Package design engineer

Are you enthusiastic about new technologies? This position is an excellent opportunity for an expert and highly motivated package design engineer to join the Package Design team and work on the future of System-in-Package designs, focusing on finding the optimum implementations that will improve Arm IP performance.
The semiconductor industry transitioned from multichip modules, then to SoC and is now moving into sophisticated System-in-Package (SiP) which changes the influence of Arm IP. Arm IP will begin to span multiple pieces of silicon in a system and optimizing this interaction is important for internal development and enabling partner success, The Package design engineer will be in charge of drawing novel System-in-Package designs. State of the art power delivery techniques and interfaces will be key in emerging technologies as advanced packaging is growing in industry importance.
The engineer will be responsible for the definition, design, and verification of package designs. Candidate will work closely with teams in France, US, UK, and other ARM locations on need basis. Candidate will interact with digital designers (P&R) on the inputs and constraints to build efficient designs, and also interact with SI/PI engineers. Clear communication with other team members is important.
The job will be based out of Cambridge or Sophia Arm premises., You will work directly with engineers across the company to build next-generation systems. You will have a direct impact on our bottom line and the ability to deliver improvements for our customers. You will be part of a growing, fast-paced, and fun team. You will have ownership for the implementation of your work.

• Engineering degree or equivalent


• You hold ideally 5 or more years of experience in package drawing


• Able to choose trade-offs to obtain best drawing strategy


• Proficient in usage of package drawing tools (Cadence APD/Allegro or equivalent)
  
  Good understanding SoC implementations and data exchanged between SoC team and package design team


• Knowledge in packaging manufacturing steps, and their constraints


• Knowledge on PCB design and constraints on package


• Knowledgeable in SI/PI concepts and their impact on package design trade-offs.